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A novel resistance measurement methodology for in-situ UBM/Solder interfacial reaction monitoring

dc.contributor.authorHou, Lin
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-28T22:37:33Z
dc.date.available2021-10-28T22:37:33Z
dc.date.issued2020
dc.identifier.issn2156-3950
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/35283
dc.sourceIIOimport
dc.titleA novel resistance measurement methodology for in-situ UBM/Solder interfacial reaction monitoring
dc.typeJournal article
dc.contributor.imecauthorHou, Lin
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewyes
dc.source.beginpage30
dc.source.endpage38
dc.source.journalIEEE Transactions on Components, Packaging and Manufacturing Technology
dc.source.issue1
dc.source.volume10
dc.identifier.urlhttps://ieeexplore.ieee.org/abstract/document/8887532
imec.availabilityPublished - imec


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