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Impact of mechanical stress on 3-D NAND current conduction

dc.contributor.authorKruv, Anastasiia
dc.contributor.authorArreghini, Antonio
dc.contributor.authorVerreck, Devin
dc.contributor.authorGonzalez, Mario
dc.contributor.authorVan den Bosch, Geert
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorRosmeulen, Maarten
dc.date.accessioned2021-10-28T23:33:25Z
dc.date.available2021-10-28T23:33:25Z
dc.date.issued2020
dc.identifier.issn0018-9383
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/35421
dc.sourceIIOimport
dc.titleImpact of mechanical stress on 3-D NAND current conduction
dc.typeJournal article
dc.contributor.imecauthorKruv, Anastasiia
dc.contributor.imecauthorArreghini, Antonio
dc.contributor.imecauthorVerreck, Devin
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVan den Bosch, Geert
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorRosmeulen, Maarten
dc.contributor.orcidimecArreghini, Antonio::0000-0002-7493-9681
dc.contributor.orcidimecVerreck, Devin::0000-0002-3833-5880
dc.contributor.orcidimecVan den Bosch, Geert::0000-0001-9971-6954
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecRosmeulen, Maarten::0000-0002-3663-7439
dc.source.peerreviewyes
dc.source.beginpage4891
dc.source.endpage4
dc.source.journalIEEE Transactions on Electron Devices
dc.source.issue11
dc.source.volume67
dc.identifier.urlhttps://ieeexplore.ieee.org/abstract/document/9210045
imec.availabilityPublished - imec


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