Show simple item record

dc.contributor.authorMonte, Ann
dc.contributor.authorDaems, Jef
dc.contributor.authorMissinne, Jeroen
dc.date.accessioned2021-10-29T00:59:55Z
dc.date.available2021-10-29T00:59:55Z
dc.date.issued2020
dc.identifier.issn2156-3950
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/35605
dc.sourceIIOimport
dc.titleFabrication of a shear stress sensor matrix using standard printed circuit board and overmoulding technologies
dc.typeJournal article
dc.contributor.imecauthorMissinne, Jeroen
dc.contributor.orcidimecMissinne, Jeroen::0000-0002-3470-620X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage479
dc.source.endpage486
dc.source.journalIEEE Transactions on Components, Packaging and Manufacturing Technology
dc.source.issue3
dc.source.volume10
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8970323
imec.availabilityPublished - open access


Files in this item

Thumbnail

This item appears in the following collection(s)

Show simple item record