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Low-cost energy efficient on-chip hotspot targeted microjet cooling for high power electronics

dc.contributor.authorWei, Tiwei
dc.contributor.authorOprins, Herman
dc.contributor.authorCherman, Vladimir
dc.contributor.authorBeyne, Eric
dc.contributor.authorBaelmans, Martine
dc.date.accessioned2021-10-29T08:01:09Z
dc.date.available2021-10-29T08:01:09Z
dc.date.issued2020
dc.identifier.issn2156-3950
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/36321
dc.sourceIIOimport
dc.titleLow-cost energy efficient on-chip hotspot targeted microjet cooling for high power electronics
dc.typeJournal article
dc.contributor.imecauthorWei, Tiwei
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage577
dc.source.endpage589
dc.source.journalIEEE Transactions on Components, Packaging and Manufacturing Technology
dc.source.issue4
dc.source.volume10
dc.identifier.urlhttps://ieeexplore.ieee.org/abstract/document/8878025
imec.availabilityPublished - imec


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