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dc.contributor.authorZahedmanesh, Houman
dc.contributor.authorVanstreels, Kris
dc.date.accessioned2021-10-29T08:47:51Z
dc.date.available2021-10-29T08:47:51Z
dc.date.issued2020
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/36390
dc.sourceIIOimport
dc.titleMechanical integrity of back-end-of-Line with Ru nanowires and airgaps
dc.typeJournal article
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.identifier.doi10.1016/j.microrel.2020.113700
dc.source.peerreviewyes
dc.source.beginpage113700
dc.source.journalMicroelectronics Reliability
dc.source.volume110
imec.availabilityPublished - imec


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