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dc.contributor.authorZhou, L.
dc.contributor.authorLiu, Q.
dc.contributor.authorYang, H.
dc.contributor.authorJi, Z.
dc.contributor.authorXu, H.
dc.contributor.authorTang, B.
dc.contributor.authorSimoen, Eddy
dc.contributor.authorJiang, H.
dc.contributor.authorLuo, Y.
dc.contributor.authorWang, X.
dc.contributor.authorMa, X.
dc.contributor.authorLi, Y.
dc.contributor.authorLuo, J.
dc.contributor.authorYin, H.
dc.contributor.authorZhao, C.
dc.contributor.authorWang, W.
dc.date.accessioned2021-10-29T09:05:07Z
dc.date.available2021-10-29T09:05:07Z
dc.date.issued2020
dc.identifier.issn1530-4388
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/36415
dc.sourceIIOimport
dc.titleInsights into the effect of TiN thickness scaling on DC and AC NBTI characteristics in replacement metal gate pMOSFETs
dc.typeJournal article
dc.contributor.imecauthorSimoen, Eddy
dc.contributor.orcidimecSimoen, Eddy::0000-0002-5218-4046
dc.source.peerreviewyes
dc.source.beginpage498
dc.source.endpage505
dc.source.journalIEEE Transactions on Device and Materials Reliability
dc.source.issue3
dc.source.volume20
dc.identifier.urlhttps://ieeexplore.ieee.org/document/9103041
imec.availabilityPublished - imec


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