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Electroless deposition of Cu with solutions containing either Mg2+ or Pd2+ ions

dc.contributor.authorMouroux, Aliette
dc.contributor.authorZhang, S. L.
dc.contributor.authorPalmans, Roger
dc.contributor.authorMin, Woo Sig
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-14T11:31:11Z
dc.date.available2021-10-14T11:31:11Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3688
dc.sourceIIOimport
dc.titleElectroless deposition of Cu with solutions containing either Mg2+ or Pd2+ ions
dc.typeJournal article
dc.contributor.imecauthorMaex, Karen
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage232
dc.source.endpage235
dc.source.journalPhysica Scripta
dc.source.issueT79
imec.availabilityPublished - open access


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