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dc.contributor.authorFang, Liang
dc.contributor.authorBaelmans, Martine
dc.contributor.authorWei, Tiwei
dc.contributor.authorOprins, Herman
dc.contributor.authorCherman, Vladimir
dc.contributor.authorBeyne, Eric
dc.date.accessioned2022-04-08T13:42:51Z
dc.date.available2021-11-02T15:55:38Z
dc.date.available2022-04-08T13:42:51Z
dc.date.issued2022-01
dc.identifier.issn0017-9310
dc.identifier.otherWOS:000706133100004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/37460.2
dc.sourceWOS
dc.titleHeat transfer and pressure drop correlations for direct on-chip microscale jet impingement cooling with alternating feeding and draining jets
dc.typeJournal article
dc.contributor.imecauthorWei, Tiwei
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.identifier.doi10.1016/j.ijheatmasstransfer.2021.121865
dc.source.numberofpages14
dc.source.peerreviewyes
dc.source.beginpage121865
dc.source.journalINTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
dc.source.issueNA
dc.source.volume182
imec.availabilityUnder review


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