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Broadband Metallic Fiber-to-Chip Couplers and a Low-Complexity Integrated Plasmonic Platform
dc.contributor.author | Messner, Andreas | |
dc.contributor.author | Jud, Pascal A. | |
dc.contributor.author | Winiger, Joel | |
dc.contributor.author | Eppenberger, Marco | |
dc.contributor.author | Chelladurai, Daniel | |
dc.contributor.author | Heni, Wolfgang | |
dc.contributor.author | Baeuerle, Benedikt | |
dc.contributor.author | Koch, Ueli | |
dc.contributor.author | Ma, Ping | |
dc.contributor.author | Haffner, Christian | |
dc.contributor.author | Xu, Huajun | |
dc.contributor.author | Elder, Delwin L. | |
dc.contributor.author | Dalton, Larry R. | |
dc.contributor.author | Smajic, Jasmin | |
dc.contributor.author | Leuthold, Juerg | |
dc.date.accessioned | 2021-11-02T16:00:49Z | |
dc.date.available | 2021-11-02T16:00:49Z | |
dc.date.issued | 2021-JUN 9 | |
dc.identifier.issn | 1530-6984 | |
dc.identifier.other | WOS:000662078500004 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/37858 | |
dc.source | WOS | |
dc.title | Broadband Metallic Fiber-to-Chip Couplers and a Low-Complexity Integrated Plasmonic Platform | |
dc.type | Journal article | |
dc.contributor.imecauthor | Haffner, Christian | |
dc.contributor.orcidimec | Haffner, Christian::0000-0002-8947-5293 | |
dc.identifier.doi | 10.1021/acs.nanolett.0c05069 | |
dc.source.numberofpages | 7 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 4539 | |
dc.source.endpage | 4545 | |
dc.source.journal | NANO LETTERS | |
dc.identifier.pmid | MEDLINE:34006114 | |
dc.source.issue | 11 | |
dc.source.volume | 21 | |
imec.availability | Under review |
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