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ELD NiB for microbumps passivation and wirebonding

dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorDe Preter, Inge
dc.contributor.authorEl-Mekki, Zaid
dc.contributor.authorHou, Lin
dc.contributor.authorGerets, Carine
dc.contributor.authorDictus, Dries
dc.contributor.authorVanstreels, Kris
dc.contributor.authorCroes, Kristof
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2022-01-10T10:46:51Z
dc.date.available2021-11-02T16:03:16Z
dc.date.available2022-01-10T10:46:51Z
dc.date.issued2020
dc.identifier.issnna
dc.identifier.otherWOS:000631824100064
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/38044.2
dc.sourceWOS
dc.titleELD NiB for microbumps passivation and wirebonding
dc.typeProceedings paper
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorDe Preter, Inge
dc.contributor.imecauthorEl-Mekki, Zaid
dc.contributor.imecauthorHou, Lin
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorDictus, Dries
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecDictus, Dries::0000-0002-7896-1747
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.identifier.eisbn978-1-7281-6293-5
dc.source.numberofpages6
dc.source.peerreviewyes
dc.source.conference8th IEEE Electronics System-Integration Technology Conference (ESTC)
dc.source.conferencedateSEP 15-18, 2020
dc.source.conferencelocationVestfold
dc.source.journalna
imec.availabilityPublished - imec


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220.500.12860/38044.2*2022-01-10T10:46:05Zvalidation by library/open access desk
120.500.12860/380442021-11-02T16:03:16Z

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