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Demonstration of a collective hybrid die-to-wafer integration

dc.contributor.authorSuhard, Samuel
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorKennes, Koen
dc.contributor.authorBex, Pieter
dc.contributor.authorFodor, Ferenc
dc.contributor.authorBeyne, Eric
dc.contributor.authorLiebens, Maarten
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.date.accessioned2022-01-07T11:04:01Z
dc.date.available2021-11-02T16:04:36Z
dc.date.available2022-01-07T11:04:01Z
dc.date.issued2020
dc.identifier.issn0569-5503
dc.identifier.otherWOS:000620983200196
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/38151.2
dc.sourceWOS
dc.titleDemonstration of a collective hybrid die-to-wafer integration
dc.typeProceedings paper
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorKennes, Koen
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorFodor, Ferenc
dc.contributor.imecauthorSlabbekoorn, Maarten Liebens John
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorLiebens, Maarten
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.identifier.doi10.1109/ECTC32862.2020.00208
dc.identifier.eisbn978-1-7281-6180-8
dc.source.numberofpages7
dc.source.peerreviewyes
dc.source.beginpage1315
dc.source.endpage1321
dc.source.conference70th IEEE Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateJUN 03-30, 2020
dc.source.conferencelocationOrlando, FL, USA
dc.source.journalna
imec.availabilityPublished - imec


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220.500.12860/38151.2*2022-01-07T11:00:32Zvalidation by library/open access desk
120.500.12860/381512021-11-02T16:04:36Z

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