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10 and 7 mu m Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process

dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorCherman, Vladimir
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorDe Preter, Inge
dc.contributor.authorHou, Lin
dc.contributor.authorBex, Pieter
dc.contributor.authorGerets, Carine
dc.contributor.authorDuval, Fabrice
dc.contributor.authorWebers, Tomas
dc.contributor.authorBertheau, Julien
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorShafahian, Ehsan
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.date.accessioned2021-12-14T09:06:41Z
dc.date.available2021-11-02T16:04:36Z
dc.date.available2021-12-14T09:06:41Z
dc.date.issued2020
dc.identifier.issn0569-5503
dc.identifier.otherWOS:000620983200091
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/38152.2
dc.sourceWOS
dc.title10 and 7 mu m Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process
dc.typeProceedings paper
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorDe Preter, Inge
dc.contributor.imecauthorHou, Lin
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorDuval, Fabrice
dc.contributor.imecauthorWebers, Tomas
dc.contributor.imecauthorBertheau, Julien
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorShafahian, Ehsan
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.identifier.doi10.1109/ECTC32862.2020.00102
dc.identifier.eisbn978-1-7281-6180-8
dc.source.numberofpages6
dc.source.peerreviewyes
dc.source.beginpage617
dc.source.endpage622
dc.source.conference70th IEEE Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateJUN 03-30, 2020
dc.source.conferencelocationOrlando, FL, USA
dc.source.journalna
imec.availabilityPublished - imec


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220.500.12860/38152.2*2021-12-14T09:04:18Zvalidation by library/open access desk
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