Show simple item record

Thermal Aspects of Silicon Photonic Interposer Packages

dc.contributor.authorOprins, Herman
dc.contributor.authorBan, Yoojin
dc.contributor.authorCherman, Vladimir
dc.contributor.authorVan Campenhout, Joris
dc.date.accessioned2022-01-27T11:25:31Z
dc.date.available2021-11-02T16:04:52Z
dc.date.available2022-01-27T11:24:10Z
dc.date.available2022-01-27T11:25:31Z
dc.date.issued2020
dc.identifier.issnna
dc.identifier.otherWOS:000618046600013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/38166.3
dc.sourceWOS
dc.titleThermal Aspects of Silicon Photonic Interposer Packages
dc.typeProceedings paper
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorBan, Yoojin
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorVan Campenhout, Joris
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecVan Campenhout, Joris::0000-0003-0778-2669
dc.identifier.eisbn978-1-7281-6049-8
dc.source.numberofpages6
dc.source.peerreviewyes
dc.source.conference21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
dc.source.conferencedateJUL 05-08, 2020
dc.source.conferencelocationCracow
dc.source.journalna
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record

Version history

VersionItemDateSummary
320.500.12860/38166.3*2022-01-27T11:25:08Zvalidation by library/open access desk
220.500.12860/38166.22021-11-08T08:45:02Zvalidation by imec author
120.500.12860/381662021-11-02T16:04:52Z

*Selected version