High-density and alignment-tolerant integration of monitoring photodetector arrays onto polymeric guided-wave components
dc.contributor.author | Van der Linden, J. E. | |
dc.contributor.author | De Dobbelaere, Peter | |
dc.contributor.author | Van Daele, Peter | |
dc.contributor.author | Diemeer, M. B. | |
dc.date.accessioned | 2021-10-14T11:46:27Z | |
dc.date.available | 2021-10-14T11:46:27Z | |
dc.date.issued | 1999 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/3917 | |
dc.source | IIOimport | |
dc.title | High-density and alignment-tolerant integration of monitoring photodetector arrays onto polymeric guided-wave components | |
dc.type | Journal article | |
dc.contributor.imecauthor | Van Daele, Peter | |
dc.contributor.orcidimec | Van Daele, Peter::0000-0003-0557-7741 | |
dc.source.peerreview | no | |
dc.source.beginpage | 534 | |
dc.source.endpage | 540 | |
dc.source.journal | IEEE Trans. Components, Packaging and Manufacturing Technology B: Advanced Packaging | |
dc.source.issue | 4 | |
dc.source.volume | 22 | |
imec.availability | Published - imec |
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