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Two-level MOL and VHV routing style to enable extreme height scaling beyond 2nm technology node

dc.contributor.authorChehab, Bilal
dc.contributor.authorZografos, Odysseas
dc.contributor.authorLitta, Eugenio Dentoni
dc.contributor.authorAhmed, Zubair
dc.contributor.authorSchuddinck, Pieter
dc.contributor.authorJang, Doyoung
dc.contributor.authorHellings, Geert
dc.contributor.authorSpessot, Alessio
dc.contributor.authorWeckx, Pieter
dc.contributor.authorRyckaert, Julien
dc.date.accessioned2022-05-05T02:17:26Z
dc.date.available2022-05-05T02:17:26Z
dc.date.issued2021
dc.identifier.issn2380-632X
dc.identifier.otherWOS:000784773200057
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/39737
dc.sourceWOS
dc.titleTwo-level MOL and VHV routing style to enable extreme height scaling beyond 2nm technology node
dc.typeProceedings paper
dc.contributor.imecauthorChehab, Bilal
dc.contributor.imecauthorZografos, Odysseas
dc.contributor.imecauthorLitta, Eugenio Dentoni
dc.contributor.imecauthorAhmed, Zubair
dc.contributor.imecauthorSchuddinck, Pieter
dc.contributor.imecauthorJang, Doyoung
dc.contributor.imecauthorHellings, Geert
dc.contributor.imecauthorSpessot, Alessio
dc.contributor.imecauthorWeckx, Pieter
dc.contributor.imecauthorRyckaert, Julien
dc.contributor.orcidimecZografos, Odysseas::0000-0002-9998-8009
dc.contributor.orcidimecHellings, Geert::0000-0002-5376-2119
dc.identifier.doi10.1109/IITC51362.2021.9537557
dc.identifier.eisbn978-1-7281-7632-1
dc.source.numberofpages3
dc.source.peerreviewyes
dc.source.conferenceIEEE International Interconnect Technology Conference (IITC)
dc.source.conferencedateJUL 06-09, 2021
imec.availabilityUnder review


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320.500.12860/39737.32022-06-17T07:55:34Zvalidation by library/open access desk
220.500.12860/39737.22022-05-11T09:30:37Zvalidation by imec author
120.500.12860/39737*2022-05-05T02:17:26Z

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