Browsing Conference contributions by imec author "12fcd23f2b6492e64969d9abc3d73c718872de96"
Now showing items 1-2 of 2
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Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications
Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; Yang, Z.; Rivera, K.; Van der Plas, Geert; Pawlak, Bartek; England, L.; Beyne, Eric; Baelmans, M. (2020) -
Thermal, Mechanical and Reliability assessment of Hybrid bonded wafers, bonded at 2.5 mu m pitch
Cherman, Vladimir; Van Huylenbroeck, Stefaan; Lofrano, Melina; Chang, Xinyue; Oprins, Herman; Gonzalez, Mario; Van der Plas, Geert; Beyer, Gerald; Rebibis, Kenneth June; Beyne, Eric (2020)