dc.contributor.author | Vohra, Anurag | |
dc.contributor.author | Geens, Karen | |
dc.contributor.author | Zhao, Ming | |
dc.contributor.author | Syshchyk, Olga | |
dc.contributor.author | Hahn, Herwig | |
dc.contributor.author | Fahle, Dirk | |
dc.contributor.author | Bakeroot, Benoit | |
dc.contributor.author | Wellekens, Dirk | |
dc.contributor.author | Vanhove, Benjamin | |
dc.contributor.author | Langer, Robert | |
dc.contributor.author | Decoutere, Stefaan | |
dc.date.accessioned | 2022-08-31T10:28:42Z | |
dc.date.available | 2022-07-10T02:26:50Z | |
dc.date.available | 2022-07-12T17:53:03Z | |
dc.date.available | 2022-07-15T10:11:37Z | |
dc.date.available | 2022-08-31T10:28:42Z | |
dc.date.issued | 2022 | |
dc.identifier.issn | 0003-6951 | |
dc.identifier.other | WOS:000817798300001 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/40104.4 | |
dc.source | WOS | |
dc.title | Epitaxial buffer structures grown on 200 mm engineering substrates for 1200 V E-mode HEMT application | |
dc.type | Journal article | |
dc.contributor.imecauthor | Vohra, Anurag | |
dc.contributor.imecauthor | Geens, Karen | |
dc.contributor.imecauthor | Zhao, Ming | |
dc.contributor.imecauthor | Syshchyk, Olga | |
dc.contributor.imecauthor | Bakeroot, Benoit | |
dc.contributor.imecauthor | Wellekens, Dirk | |
dc.contributor.imecauthor | Vanhove, Benjamin | |
dc.contributor.imecauthor | Langer, Robert | |
dc.contributor.imecauthor | Decoutere, Stefaan | |
dc.contributor.orcidimec | Vohra, Anurag::0000-0002-2831-0719 | |
dc.contributor.orcidimec | Geens, Karen::0000-0003-1815-3972 | |
dc.contributor.orcidimec | Zhao, Ming::0000-0002-0856-851X | |
dc.contributor.orcidimec | Bakeroot, Benoit::0000-0003-4392-1777 | |
dc.contributor.orcidimec | Langer, Robert::0000-0002-1132-3468 | |
dc.contributor.orcidimec | Decoutere, Stefaan::0000-0001-6632-6239 | |
dc.contributor.orcidimec | Syshchyk, Olga::0000-0001-8110-3754 | |
dc.contributor.orcidimec | Wellekens, Dirk::0000-0003-4532-5784 | |
dc.date.embargo | 2023-06-28 | |
dc.identifier.doi | 10.1063/5.0097797 | |
dc.source.numberofpages | 7 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 261902 | |
dc.source.journal | APPLIED PHYSICS LETTERS | |
dc.source.issue | 26 | |
dc.source.volume | 120 | |
imec.availability | Published - open access | |
dc.description.wosFundingText | This project has received funding from the "Electronics Components and Systems for European Leadership" Joint Undertaking (ECSEL JU) under Grant Agreement No. 783174. The JU receives support from the European Union's Horizon 2020 research and innovation program from Austria, Spain, Belgium, Germany, Slovakia, Italy, Netherlands, and Slovenia. | |