Stress relaxation in Al-Cu and Al-Si-Cu thin films
dc.contributor.author | Witvrouw, Ann | |
dc.contributor.author | Proost, Joris | |
dc.contributor.author | Roussel, Philippe | |
dc.contributor.author | Cosemans, P. | |
dc.contributor.author | Maex, Karen | |
dc.date.accessioned | 2021-10-14T11:58:08Z | |
dc.date.available | 2021-10-14T11:58:08Z | |
dc.date.issued | 1999 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/4031 | |
dc.source | IIOimport | |
dc.title | Stress relaxation in Al-Cu and Al-Si-Cu thin films | |
dc.type | Journal article | |
dc.contributor.imecauthor | Roussel, Philippe | |
dc.contributor.imecauthor | Maex, Karen | |
dc.contributor.orcidimec | Roussel, Philippe::0000-0002-0402-8225 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | no | |
dc.source.beginpage | 1246 | |
dc.source.endpage | 1254 | |
dc.source.journal | J. Materials Research | |
dc.source.issue | 4 | |
dc.source.volume | 14 | |
imec.availability | Published - open access |