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dc.contributor.authorBrady-Boyd, Anita
dc.contributor.authorChery, Emmanuel
dc.contributor.authorArmini, Silvia
dc.date.accessioned2022-11-10T09:28:36Z
dc.date.available2022-09-08T02:38:35Z
dc.date.available2022-11-10T09:28:36Z
dc.date.issued2022
dc.identifier.issn1948-7185
dc.identifier.otherWOS:000848554500001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40364.2
dc.sourceWOS
dc.titleInvestigating the Efficacy of Hafnium Dioxide Barrier Layers to Halt Copper Oxide Formation in Redistribution Layers for Three-Dimensional (3D) Packaging
dc.typeJournal article
dc.contributor.imecauthorBrady-Boyd, Anita
dc.contributor.imecauthorChery, Emmanuel
dc.contributor.imecauthorArmini, Silvia
dc.contributor.orcidimecBrady-Boyd, Anita::0000-0002-9257-6837
dc.contributor.orcidimecChery, Emmanuel::0000-0002-2526-3873
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.identifier.doi10.1021/acs.jpclett.2c02080
dc.source.numberofpages4
dc.source.peerreviewyes
dc.source.beginpage8130
dc.source.endpage8133
dc.source.journalJOURNAL OF PHYSICAL CHEMISTRY LETTERS
dc.identifier.pmidMEDLINE:36000826
dc.source.issue34
dc.source.volume13
imec.availabilityPublished - open access
dc.description.wosFundingTextThis project has received funding from the European Union's Horizon 2020 research and innovation programme under the Marie Sklodowska-Curie g r a n t agreement No. 888163. The authors would like to thank Dr. E. Vancoille and Dr. O. Richard for the FIB analysis. Our sincere thanks and appreciation go to JSR Corporation and JSR Micro N.V. for providing the photosensitive polymer used in this study.


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