dc.contributor.author | Schram, Tom | |
dc.contributor.author | Sutar, Surajit | |
dc.contributor.author | Radu, Iuliana | |
dc.contributor.author | Asselberghs, Inge | |
dc.date.accessioned | 2023-01-05T13:21:58Z | |
dc.date.available | 2022-09-13T02:51:20Z | |
dc.date.available | 2022-12-02T08:42:08Z | |
dc.date.available | 2023-01-05T13:21:58Z | |
dc.date.issued | 2022-12-01 | |
dc.identifier.issn | 0935-9648 | |
dc.identifier.other | WOS:000850640000001 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/40421.3 | |
dc.source | WOS | |
dc.title | Challenges of Wafer-Scale Integration of 2D Semiconductors for High-Performance Transistor Circuits | |
dc.type | Journal article | |
dc.contributor.imecauthor | Schram, Tom | |
dc.contributor.imecauthor | Sutar, Surajit | |
dc.contributor.imecauthor | Radu, Iuliana | |
dc.contributor.imecauthor | Asselberghs, Inge | |
dc.contributor.orcidimec | Schram, Tom::0000-0003-1533-7055 | |
dc.contributor.orcidimec | Sutar, Surajit::0000-0003-3114-718X | |
dc.contributor.orcidimec | Radu, Iuliana::0000-0002-7230-7218 | |
dc.contributor.orcidimec | Asselberghs, Inge::0000-0001-8371-3222 | |
dc.date.embargo | 2022-09-07 | |
dc.identifier.doi | 10.1002/adma.202109796 | |
dc.source.numberofpages | 13 | |
dc.source.peerreview | yes | |
dc.subject.discipline | Electrical & electronic engineering | |
dc.source.beginpage | 2109796 | |
dc.source.endpage | 2109796 | |
dc.source.journal | ADVANCED MATERIALS | |
dc.identifier.pmid | MEDLINE:36071023 | |
dc.source.issue | 48 | |
dc.source.volume | 34 | |
imec.availability | Published - open access | |
dc.description.wosFundingText | This work was done in the imec IIAP core CMOS programs. This work received funding from the European Union's Graphene Flagship grant agreement No 952792. The authors also thank COVENTOR for the access to the SEMulator3D software, and specifically Assawer Sousou for the technical support. The authors also thank the entire IMEC 2D project team for the discussions preceding the preparation if the paper. | |