dc.contributor.author | Derakhshandeh, Jaber | |
dc.contributor.author | Beyne, Eric | |
dc.contributor.author | Beyer, Gerald | |
dc.contributor.author | Capuz, Giovanni | |
dc.contributor.author | Cherman, Vladimir | |
dc.contributor.author | De Preter, Inge | |
dc.contributor.author | Gerets, Carine | |
dc.contributor.author | Shafahian, Ehsan | |
dc.contributor.author | Kennes, Koen | |
dc.contributor.author | Jamieson, Geraldine | |
dc.contributor.author | Cochet, Tom | |
dc.contributor.author | Webers, Tomas | |
dc.contributor.author | Tobback, Bert | |
dc.contributor.author | Van der Plas, Geert | |
dc.contributor.author | La Tulipe, Douglas Charles | |
dc.contributor.author | Phommahaxay, Alain | |
dc.contributor.author | Miller, Andy | |
dc.date.accessioned | 2023-02-23T12:33:42Z | |
dc.date.available | 2022-09-17T02:52:08Z | |
dc.date.available | 2023-02-23T12:33:42Z | |
dc.date.issued | 2022 | |
dc.identifier.issn | 0569-5503 | |
dc.identifier.other | WOS:000848765300172 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/40443.3 | |
dc.source | WOS | |
dc.title | Low temperature backside damascene processing on temporary carrier wafer targeting 7 mu m and 5 mu m pitch microbumps for N equal and greater than 2 die to wafer TCB stacking | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Derakhshandeh, Jaber | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.imecauthor | Beyer, Gerald | |
dc.contributor.imecauthor | Capuz, Giovanni | |
dc.contributor.imecauthor | Cherman, Vladimir | |
dc.contributor.imecauthor | De Preter, Inge | |
dc.contributor.imecauthor | Gerets, Carine | |
dc.contributor.imecauthor | Shafahian, Ehsan | |
dc.contributor.imecauthor | Kennes, Koen | |
dc.contributor.imecauthor | Jamieson, Geraldine | |
dc.contributor.imecauthor | Cochet, Tom | |
dc.contributor.imecauthor | Webers, Tomas | |
dc.contributor.imecauthor | Tobback, Bert | |
dc.contributor.imecauthor | Van der Plas, Geert | |
dc.contributor.imecauthor | La Tulipe, Douglas Charles | |
dc.contributor.imecauthor | Phommahaxay, Alain | |
dc.contributor.imecauthor | Miller, Andy | |
dc.contributor.orcidimec | Derakhshandeh, Jaber::0000-0003-2448-9165 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.contributor.orcidimec | Capuz, Giovanni::0000-0002-5263-4836 | |
dc.contributor.orcidimec | Cherman, Vladimir::0000-0002-8068-9236 | |
dc.contributor.orcidimec | Shafahian, Ehsan::0000-0001-6125-5793 | |
dc.contributor.orcidimec | Jamieson, Geraldine::0000-0002-6750-097X | |
dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
dc.contributor.orcidimec | Phommahaxay, Alain::0000-0001-8672-2386 | |
dc.contributor.orcidimec | Miller, Andy::0000-0001-7048-2242 | |
dc.identifier.doi | 10.1109/ECTC51906.2022.00179 | |
dc.identifier.eisbn | 978-1-6654-7943-1 | |
dc.source.numberofpages | 6 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 1108 | |
dc.source.endpage | 1113 | |
dc.source.conference | 72nd IEEE Electronic Components and Technology Conference (ECTC) | |
dc.source.conferencedate | MAY 31-JUN 01, 2022 | |
dc.source.conferencelocation | San Diego | |
dc.source.journal | na | |
imec.availability | Published - imec | |