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Advanced PCB technologies: Photovia buildup, electroless nickel plating and flip chip on board

dc.contributor.authorZhang, S.
dc.date.accessioned2021-10-14T11:59:43Z
dc.date.available2021-10-14T11:59:43Z
dc.date.issued1999-11
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4045
dc.sourceIIOimport
dc.titleAdvanced PCB technologies: Photovia buildup, electroless nickel plating and flip chip on board
dc.typePHD thesis
dc.source.peerreviewno
imec.availabilityPublished - imec
imec.internalnotesThesis Advisors : Prof. Dr. Ir. A. Van Calster


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