Show simple item record

A new approach to flip chip on board technology using SMT compatible processes

dc.contributor.authorZhang, S.
dc.contributor.authorDe Baets, J.
dc.contributor.authorVan Calster, Andre
dc.date.accessioned2021-10-14T11:59:49Z
dc.date.available2021-10-14T11:59:49Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4046
dc.sourceIIOimport
dc.titleA new approach to flip chip on board technology using SMT compatible processes
dc.typeJournal article
dc.contributor.imecauthorVan Calster, Andre
dc.source.peerreviewno
dc.source.beginpage39
dc.source.endpage42
dc.source.journalMicroelectronics International
dc.source.issue3
dc.source.volume16
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record