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Fundamental study of IMC grains at low anneal temperature

dc.contributor.authorGerets, Carine
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorShafahian, Ehsan
dc.contributor.authorCochet, Tom
dc.contributor.authorLa Tulipe, Douglas Charles
dc.contributor.authorBeyer, Gerald
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.date.accessioned2023-06-20T07:55:55Z
dc.date.available2022-09-22T02:50:27Z
dc.date.available2023-06-20T07:55:55Z
dc.date.issued2022
dc.identifier.issnna
dc.identifier.otherWOS:000851392600067
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40472.3
dc.sourceWOS
dc.titleFundamental study of IMC grains at low anneal temperature
dc.typeProceedings paper
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorShafahian, Ehsan
dc.contributor.imecauthorCochet, Tom
dc.contributor.imecauthorLa Tulipe, Douglas Charles
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecShafahian, Ehsan::0000-0001-6125-5793
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.identifier.eisbn978-4-9911911-3-8
dc.source.numberofpages2
dc.source.peerreviewyes
dc.source.beginpage133
dc.source.endpage134
dc.source.conferenceInternational Conference on Electronics Packaging (ICEP)
dc.source.conferencedateMAY 11-14, 2022
dc.source.conferencelocationSapporo
dc.source.journalna
imec.availabilityPublished - imec


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320.500.12860/40472.3*2023-06-20T07:55:03Zvalidation by library/open access desk
120.500.12860/404722022-09-22T02:50:27Z

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