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III-V on a Si platform for the next generations of communication systems
dc.contributor.author | Parvais, B. | |
dc.contributor.author | Vais, A. | |
dc.contributor.author | Yadav, S. | |
dc.contributor.author | Mols, Y. | |
dc.contributor.author | Vermeersch, B. | |
dc.contributor.author | Kodanarama, K. Vondkar | |
dc.contributor.author | Boccardi, G. | |
dc.contributor.author | Kunert, B. | |
dc.contributor.author | Collaert, N. | |
dc.date.accessioned | 2022-09-22T02:50:30Z | |
dc.date.available | 2022-09-22T02:50:30Z | |
dc.date.issued | 2022 | |
dc.identifier.other | WOS:000852566800084 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/40479 | |
dc.source | WOS | |
dc.title | III-V on a Si platform for the next generations of communication systems | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Parvais, B. | |
dc.contributor.imecauthor | Vais, A. | |
dc.contributor.imecauthor | Yadav, S. | |
dc.contributor.imecauthor | Mols, Y. | |
dc.contributor.imecauthor | Vermeersch, B. | |
dc.contributor.imecauthor | Kodanarama, K. Vondkar | |
dc.contributor.imecauthor | Boccardi, G. | |
dc.contributor.imecauthor | Kunert, B. | |
dc.contributor.imecauthor | Collaert, N. | |
dc.identifier.doi | 10.1109/EDTM53872.2022.9798159 | |
dc.identifier.eisbn | 978-1-6654-2178-2 | |
dc.source.numberofpages | 3 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 250 | |
dc.source.endpage | 252 | |
dc.source.conference | 6th IEEE Electron Devices Technology and Manufacturing Conference (EDTM) | |
dc.source.conferencedate | MAR 06-09, 2022 | |
imec.availability | Under review |
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