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Investigation on Low-temperature Temporary Bonding for Microfluidic Devices in Lifescience Applications

dc.contributor.authorHan, Yang
dc.contributor.authorDang, Chi
dc.contributor.authorVisker, Evert
dc.contributor.authorVisker, Jakob
dc.contributor.authorHumbertv, Aurelie
dc.contributor.authorPeng, Lan
dc.date.accessioned2022-09-24T02:50:53Z
dc.date.available2022-09-24T02:50:53Z
dc.date.issued2021
dc.identifier.otherWOS:000853032600036
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40496
dc.sourceWOS
dc.titleInvestigation on Low-temperature Temporary Bonding for Microfluidic Devices in Lifescience Applications
dc.typeProceedings paper
dc.contributor.imecauthorHan, Yang
dc.contributor.imecauthorDang, Chi
dc.contributor.imecauthorVisker, Evert
dc.contributor.imecauthorVisker, Jakob
dc.contributor.imecauthorHumbertv, Aurelie
dc.contributor.imecauthorPeng, Lan
dc.contributor.orcidimecVisker, Evert::0000-0002-1096-9670
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.identifier.doi10.1109/LTB-3D53950.2021.9598407
dc.identifier.eisbn978-1-6654-0567-6
dc.source.numberofpages1
dc.source.peerreviewyes
dc.source.beginpage36
dc.source.endpage36
dc.source.conference7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
dc.source.conferencedateOCT 05-11, 2021
imec.availabilityUnder review


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320.500.12860/40496.32023-01-19T15:05:36Zvalidation by library/open access desk
120.500.12860/40496*2022-09-24T02:50:53Z

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