Electrodeposition of Indium for Low Temperature 3D Stacking

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dc.contributor.author	Inoue, Fumihiro
dc.contributor.author	Park, Kimoon
dc.contributor.author	Derakhshandeh, Jaber
dc.contributor.author	Yoo, Bongyoung
dc.date.accessioned	2022-09-24T02:50:55Z
dc.date.available	2022-09-24T02:50:55Z
dc.date.issued	2021
dc.identifier.other	WOS:000853032600031
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/40498
dc.source	WOS
dc.title	Electrodeposition of Indium for Low Temperature 3D Stacking
dc.type	Proceedings paper
dc.contributor.imecauthor	Inoue, Fumihiro
dc.contributor.imecauthor	Park, Kimoon
dc.contributor.imecauthor	Derakhshandeh, Jaber
dc.contributor.orcidimec	Derakhshandeh, Jaber::0000-0003-2448-9165
dc.identifier.doi	10.1109/LTB-3D53950.2021.9598451
dc.identifier.eisbn	978-1-6654-0567-6
dc.source.numberofpages	1
dc.source.peerreview	yes
dc.source.beginpage	31
dc.source.endpage	31
dc.source.conference	7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
dc.source.conferencedate	OCT 05-11, 2021
imec.availability	Under review

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Version	Item	Date	Summary
3	20.500.12860/40498.3	2023-01-19T12:30:02Z	validation by library/open access desk
1	20.500.12860/40498*	2022-09-24T02:50:55Z