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Stabilizer concentration and local environment: their effects on electroless nickel plating of PCB micropads

dc.contributor.authorZhang, S.
dc.contributor.authorDe Baets, J.
dc.contributor.authorVereeken, Maria
dc.contributor.authorVervaet, A.
dc.contributor.authorVan Calster, Andre
dc.date.accessioned2021-10-14T12:00:12Z
dc.date.available2021-10-14T12:00:12Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4049
dc.sourceIIOimport
dc.titleStabilizer concentration and local environment: their effects on electroless nickel plating of PCB micropads
dc.typeJournal article
dc.contributor.imecauthorVan Calster, Andre
dc.source.peerreviewno
dc.source.beginpage2870
dc.source.endpage2875
dc.source.journalJ. Electrochem. Soc.
dc.source.issue8
dc.source.volume146
imec.availabilityPublished - imec


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