The Hardware Foundation of 6G: The NEW-6G Approach

Abstract

The design of future 6th Generation (6G) wireless connect-compute-control networks requires new approaches for the design of hardware, new materials and hybridization processes new technological solutions, to create a sustainable foundation for the effective operation of innovative services and use cases. In this context, the New-6G initiative focuses on solutions that capitalize on the latest advances in high-performance semiconductor technologies, integrated circuits, digital components, and wide bandwidth radio frequencies. Based on the applications and use cases, we propose two main loci that will have the largest impact: the challenges and opportunities of baseband processing on the one hand and material enablers and related device and circuit challenges on the other hand. For this second part, BiCMOS, FD-SOI, GaN and InP are highlighted as especially of interest. BiCMOS and FD-SOI have already demonstrated their possible application up to 200GHz. While BiCMOS could be potentially used at higher frequencies, III-V (GaN, InP) alternatives when integrated with CMOS could propose cost-effective solution to address higher-power and higher-efficiency sub-THz 6G applications.