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Vapor deposited thin organic-inorganic capping layers preventing copper line oxidation in polymer-based RDL technologies
dc.contributor.author | Chery, Emmanuel | |
dc.contributor.author | Brady-Boyd, Anita | |
dc.contributor.author | Lin, Yuyuan | |
dc.contributor.author | Grimes, Michael | |
dc.contributor.author | Springer, David | |
dc.contributor.author | Slabbekoorn, John | |
dc.contributor.author | Walsby, Edward | |
dc.contributor.author | Croes, Kristof | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2022-10-21T15:24:46Z | |
dc.date.available | 2022-10-21T15:24:46Z | |
dc.date.issued | 2022-10-15 | |
dc.identifier.issn | 0167-9317 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/40602 | |
dc.title | Vapor deposited thin organic-inorganic capping layers preventing copper line oxidation in polymer-based RDL technologies | |
dc.type | Journal article | |
dc.contributor.imecauthor | Chery, Emmanuel | |
dc.contributor.imecauthor | Brady-Boyd, Anita | |
dc.contributor.imecauthor | Slabbekoorn, John | |
dc.contributor.imecauthor | Croes, Kristof | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Chery, Emmanuel::0000-0002-2526-3873 | |
dc.contributor.orcidimec | Brady-Boyd, Anita::0000-0002-9257-6837 | |
dc.contributor.orcidimec | Croes, Kristof::0000-0002-3955-0638 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.contributor.orcidimec | Slabbekoorn, John::0000-0002-6098-8618 | |
dc.identifier.doi | https://doi.org/10.1016/j.mee.2022.111896 | |
dc.source.numberofpages | 7 | |
dc.source.peerreview | yes | |
dc.subject.discipline | Materials science | |
dc.source.beginpage | 111896 | |
dc.source.endpage | 111902 | |
dc.source.journal | Microelectronic Engineering | |
dc.source.issue | 15 October 2022 | |
dc.source.volume | 266 | |
imec.availability | Published - open access |