Scale Up Of Advanced Packaging And System Integration For Hybrid Technologies

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dc.contributor.author	Selim, Ramsey
dc.contributor.author	Hoofman, Romano
dc.contributor.author	Labie, Riet
dc.contributor.author	Sandeep, Veda
dc.contributor.author	Drischel, Thomas
dc.contributor.author	Torki, Kholdoun
dc.date.accessioned	2022-11-21T07:51:30Z
dc.date.available	2022-10-29T02:58:15Z
dc.date.available	2022-11-21T07:51:30Z
dc.date.issued	2021-07-02
dc.identifier.issn	NA
dc.identifier.other	WOS:000849966100023
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/40636.2
dc.source	WOS
dc.title	Scale Up Of Advanced Packaging And System Integration For Hybrid Technologies
dc.type	Proceedings paper
dc.contributor.imecauthor	Hoofman, Romano
dc.contributor.imecauthor	Labie, Riet
dc.contributor.orcidimec	Hoofman, Romano::0000-0001-8740-104X
dc.contributor.orcidimec	Labie, Riet::0000-0002-1401-1291
dc.identifier.doi	10.1109/SSI52265.2021.94669704
dc.identifier.eisbn	978-1-6654-4092-9
dc.source.numberofpages	4
dc.source.peerreview	yes
dc.subject.discipline	Electrical & electronic engineering
dc.source.conference	Conference on Smart Systems Integration (SSI)
dc.source.conferencedate	APR 27-29, 2021
dc.source.conferencelocation	Grenoble, France
dc.source.journal	2021 Smart Systems Integration (SSI)
imec.availability	Under review

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Version	Item	Date	Summary
3	20.500.12860/40636.3	2023-01-17T10:23:38Z	validation by library/open access desk
2	20.500.12860/40636.2*	2022-11-04T12:24:59Z	validation by imec author
1	20.500.12860/40636	2022-10-29T02:58:15Z

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