Show simple item record

dc.contributor.authorSelim, Ramsey
dc.contributor.authorHoofman, Romano
dc.contributor.authorLabie, Riet
dc.contributor.authorSandeep, Veda
dc.contributor.authorDrischel, Thomas
dc.contributor.authorTorki, Kholdoun
dc.date.accessioned2023-01-17T10:24:35Z
dc.date.available2022-10-29T02:58:15Z
dc.date.available2022-11-21T07:51:30Z
dc.date.available2023-01-17T10:24:35Z
dc.date.issued2021-07-02
dc.identifier.issnNA
dc.identifier.otherWOS:000849966100023
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40636.3
dc.sourceWOS
dc.titleScale Up Of Advanced Packaging And System Integration For Hybrid Technologies
dc.typeProceedings paper
dc.contributor.imecauthorHoofman, Romano
dc.contributor.imecauthorLabie, Riet
dc.contributor.orcidimecHoofman, Romano::0000-0001-8740-104X
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.identifier.doi10.1109/SSI52265.2021.9467004
dc.identifier.eisbn978-1-6654-4092-9
dc.source.numberofpages4
dc.source.peerreviewyes
dc.subject.disciplineElectrical & electronic engineering
dc.source.conferenceConference on Smart Systems Integration (SSI)
dc.source.conferencedateAPR 27-29, 2021
dc.source.conferencelocationGrenoble, France
dc.source.journal2021 Smart Systems Integration (SSI)
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record

VersionItemDateSummary

*Selected version