dc.contributor.author | Selim, Ramsey | |
dc.contributor.author | Hoofman, Romano | |
dc.contributor.author | Labie, Riet | |
dc.contributor.author | Sandeep, Veda | |
dc.contributor.author | Drischel, Thomas | |
dc.contributor.author | Torki, Kholdoun | |
dc.date.accessioned | 2023-01-17T10:24:35Z | |
dc.date.available | 2022-10-29T02:58:15Z | |
dc.date.available | 2022-11-21T07:51:30Z | |
dc.date.available | 2023-01-17T10:24:35Z | |
dc.date.issued | 2021-07-02 | |
dc.identifier.issn | NA | |
dc.identifier.other | WOS:000849966100023 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/40636.3 | |
dc.source | WOS | |
dc.title | Scale Up Of Advanced Packaging And System Integration For Hybrid Technologies | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Hoofman, Romano | |
dc.contributor.imecauthor | Labie, Riet | |
dc.contributor.orcidimec | Hoofman, Romano::0000-0001-8740-104X | |
dc.contributor.orcidimec | Labie, Riet::0000-0002-1401-1291 | |
dc.identifier.doi | 10.1109/SSI52265.2021.9467004 | |
dc.identifier.eisbn | 978-1-6654-4092-9 | |
dc.source.numberofpages | 4 | |
dc.source.peerreview | yes | |
dc.subject.discipline | Electrical & electronic engineering | |
dc.source.conference | Conference on Smart Systems Integration (SSI) | |
dc.source.conferencedate | APR 27-29, 2021 | |
dc.source.conferencelocation | Grenoble, France | |
dc.source.journal | 2021 Smart Systems Integration (SSI) | |
imec.availability | Published - imec | |