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dc.contributor.authorToscani, Nicola
dc.contributor.authorWu, Xinglong
dc.contributor.authorSpina, Domenico
dc.contributor.authorVande Ginste, Dries
dc.contributor.authorGrassi, Flavia
dc.date.accessioned2023-03-02T14:13:46Z
dc.date.available2023-01-30T03:24:15Z
dc.date.available2023-01-30T10:57:10Z
dc.date.available2023-03-02T14:13:46Z
dc.date.issued2023
dc.identifier.issn0018-9375
dc.identifier.otherWOS:000912783900001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/41049.3
dc.sourceWOS
dc.titleA Two-Step Approach for the Analysis of Bulk Current Injection Setups Involving Multiwire Bundles
dc.typeJournal article
dc.contributor.imecauthorSpina, Domenico
dc.contributor.imecauthorVande Ginste, Dries
dc.contributor.orcidimecSpina, Domenico::0000-0003-2379-5259
dc.contributor.orcidimecVande Ginste, Dries::0000-0002-0178-288X
dc.date.embargo2022-11-29
dc.identifier.doi10.1109/TEMC.2022.3223801
dc.source.numberofpages137
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage126
dc.source.journalIEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY
dc.source.issue1
dc.source.volume65
imec.availabilityPublished - open access


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