dc.contributor.author | Toscani, Nicola | |
dc.contributor.author | Wu, Xinglong | |
dc.contributor.author | Spina, Domenico | |
dc.contributor.author | Vande Ginste, Dries | |
dc.contributor.author | Grassi, Flavia | |
dc.date.accessioned | 2023-03-02T14:13:46Z | |
dc.date.available | 2023-01-30T03:24:15Z | |
dc.date.available | 2023-01-30T10:57:10Z | |
dc.date.available | 2023-03-02T14:13:46Z | |
dc.date.issued | 2023 | |
dc.identifier.issn | 0018-9375 | |
dc.identifier.other | WOS:000912783900001 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/41049.3 | |
dc.source | WOS | |
dc.title | A Two-Step Approach for the Analysis of Bulk Current Injection Setups Involving Multiwire Bundles | |
dc.type | Journal article | |
dc.contributor.imecauthor | Spina, Domenico | |
dc.contributor.imecauthor | Vande Ginste, Dries | |
dc.contributor.orcidimec | Spina, Domenico::0000-0003-2379-5259 | |
dc.contributor.orcidimec | Vande Ginste, Dries::0000-0002-0178-288X | |
dc.date.embargo | 2022-11-29 | |
dc.identifier.doi | 10.1109/TEMC.2022.3223801 | |
dc.source.numberofpages | 137 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 1 | |
dc.source.endpage | 126 | |
dc.source.journal | IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY | |
dc.source.issue | 1 | |
dc.source.volume | 65 | |
imec.availability | Published - open access | |