dc.contributor.author | Van Beek, Simon | |
dc.contributor.author | Cai, Kaiming | |
dc.contributor.author | Rao, Siddharth | |
dc.contributor.author | Jayakumar, Ganesh | |
dc.contributor.author | Couet, Sebastien | |
dc.contributor.author | Jossart, Nico | |
dc.contributor.author | Vaisman Chasin, Adrian | |
dc.contributor.author | Kar, Gouri Sankar | |
dc.date.accessioned | 2023-06-08T09:06:20Z | |
dc.date.available | 2023-02-27T03:27:55Z | |
dc.date.available | 2023-06-08T09:06:20Z | |
dc.date.issued | 2022 | |
dc.identifier.issn | 1541-7026 | |
dc.identifier.other | WOS:000922926400041 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/41155.2 | |
dc.source | WOS | |
dc.title | MTJ degradation in SOT-MRAM by self-heating-induced diffusion | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Van Beek, Simon | |
dc.contributor.imecauthor | Cai, Kaiming | |
dc.contributor.imecauthor | Rao, Siddharth | |
dc.contributor.imecauthor | Jayakumar, Ganesh | |
dc.contributor.imecauthor | Couet, Sebastien | |
dc.contributor.imecauthor | Jossart, Nico | |
dc.contributor.imecauthor | Vaisman Chasin, Adrian | |
dc.contributor.imecauthor | Kar, Gouri Sankar | |
dc.contributor.orcidimec | Van Beek, Simon::0000-0002-2499-4172 | |
dc.contributor.orcidimec | Cai, Kaiming::0000-0002-1160-864X | |
dc.contributor.orcidimec | Rao, Siddharth::0000-0001-6161-3052 | |
dc.contributor.orcidimec | Couet, Sebastien::0000-0001-6436-9593 | |
dc.contributor.orcidimec | Vaisman Chasin, Adrian::0000-0002-9940-0260 | |
dc.identifier.doi | 10.1109/IRPS48227.2022.9764459 | |
dc.identifier.eisbn | 978-1-6654-7950-9 | |
dc.source.numberofpages | 4 | |
dc.source.peerreview | yes | |
dc.source.conference | IEEE International Reliability Physics Symposium (IRPS) | |
dc.source.conferencedate | MAR 27-31, 2022 | |
dc.source.conferencelocation | Dallas | |
dc.source.journal | na | |
imec.availability | Published - imec | |
dc.description.wosFundingText | This work is supported by imec's industrial Affiliation program on STT-MRAM devices. The authors would also like to acknowledge the support of imec's fab, line and hardware teams. | |