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Electromigration-induced void evolution and failure of Cu/SiCN hybrid bonds
dc.contributor.author | Ceric, H. | |
dc.contributor.author | Zahedmanesh, H. | |
dc.contributor.author | Croes, K. | |
dc.contributor.author | Lacerda de Orio, R. | |
dc.contributor.author | Selberherr, S. | |
dc.date.accessioned | 2023-04-03T04:00:26Z | |
dc.date.available | 2023-04-03T04:00:26Z | |
dc.date.issued | 2023-MAR 14 | |
dc.identifier.issn | 0021-8979 | |
dc.identifier.other | WOS:000946168200003 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/41423 | |
dc.source | WOS | |
dc.title | Electromigration-induced void evolution and failure of Cu/SiCN hybrid bonds | |
dc.type | Journal article | |
dc.contributor.imecauthor | Zahedmanesh, H. | |
dc.contributor.imecauthor | Croes, K. | |
dc.identifier.doi | 10.1063/5.0134692 | |
dc.source.numberofpages | 13 | |
dc.source.peerreview | yes | |
dc.source.journal | JOURNAL OF APPLIED PHYSICS | |
dc.source.issue | 10 | |
dc.source.volume | 133 | |
imec.availability | Under review |
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