Publication:
Electromigration-induced void evolution and failure of Cu/SiCN hybrid bonds
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1327 since deposited on 2023-04-03
8last month
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Acq. date: 2026-08-10
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Statistics
Views
1327 since deposited on 2023-04-03
8last month
1last week
Acq. date: 2026-08-10
Citations