Skip to content
Institutional repository
Communities & Collections
Browse
Site
Log In
imec Publications
Articles
Electromigration-induced void evolution and failure of Cu/SiCN hybrid bonds
Publication:
Electromigration-induced void evolution and failure of Cu/SiCN hybrid bonds
Date
2023
Journal article
https://doi.org/10.1063/5.0134692
Simple item page
Full metadata
Statistics
Loading...
Loading...
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Ceric, H.
;
Zahedmanesh, Houman
;
Croes, Kristof
;
Lacerda de Orio, R.
;
Selberherr, S.
Journal
JOURNAL OF APPLIED PHYSICS
Abstract
Description
Metrics
Views
1300
since deposited on 2023-04-03
Acq. date: 2025-10-26
Citations
Metrics
Views
1300
since deposited on 2023-04-03
Acq. date: 2025-10-26
Citations