Publication:
Electromigration-induced void evolution and failure of Cu/SiCN hybrid bonds
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1331 since deposited on 2023-04-03
3last month
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Acq. date: 2026-10-04
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Statistics
Views
1331 since deposited on 2023-04-03
3last month
2last week
Acq. date: 2026-10-04
Citations