Publication:

Electromigration-induced void evolution and failure of Cu/SiCN hybrid bonds

Date

2023
Journal article
https://doi.org/10.1063/5.0134692
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dc.contributor.authorCeric, H.
dc.contributor.authorZahedmanesh, Houman
dc.contributor.authorCroes, Kristof
dc.contributor.authorLacerda de Orio, R.
dc.contributor.authorSelberherr, S.
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecZahedmanesh, Houman::0000-0002-0290-691X
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.accessioned2023-07-05T15:06:24Z
dc.date.available2023-04-03T04:00:26Z
dc.date.available2023-07-05T15:06:24Z
dc.date.issued2023
dc.identifier.doi10.1063/5.0134692
dc.identifier.issn0021-8979
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/41423
dc.publisherAIP Publishing
dc.source.beginpageArt. 105101
dc.source.endpagena
dc.source.issue10
dc.source.journalJOURNAL OF APPLIED PHYSICS
dc.source.numberofpages13
dc.source.volume133
dc.subject.keywordsDIFFUSION
dc.subject.keywordsFORCE
dc.subject.keywordsMODEL
dc.title

Electromigration-induced void evolution and failure of Cu/SiCN hybrid bonds

dc.typeJournal article
dspace.entity.typePublication
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