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dc.contributor.authorVermeersch, B.
dc.contributor.authorRodriguez, R.
dc.contributor.authorSibaja-Hernandez, A.
dc.contributor.authorVais, A.
dc.contributor.authorYadav, S.
dc.contributor.authorParvais, B.
dc.contributor.authorCollaert, N.
dc.date.accessioned2023-05-25T20:20:01Z
dc.date.available2023-05-25T20:20:01Z
dc.date.issued2022
dc.identifier.issn2380-9248
dc.identifier.otherWOS:000968800700029
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/41623
dc.sourceWOS
dc.titleThermal Modelling of GaN & InP RF Devices with Intrinsic Account for Nanoscale Transport Effects
dc.typeProceedings paper
dc.contributor.imecauthorVermeersch, B.
dc.contributor.imecauthorRodriguez, R.
dc.contributor.imecauthorSibaja-Hernandez, A.
dc.contributor.imecauthorVais, A.
dc.contributor.imecauthorYadav, S.
dc.contributor.imecauthorCollaert, N.
dc.identifier.doi10.1109/IEDM45625.2022.10019370
dc.identifier.eisbn978-1-6654-8959-1
dc.source.numberofpages4
dc.source.peerreviewyes
dc.source.conferenceInternational Electron Devices Meeting (IEDM)
dc.source.conferencedateDEC 03-07, 2022
dc.source.conferencelocationSan Francisco
imec.availabilityUnder review


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