dc.contributor.author | Vandecasteele, Mathieu | |
dc.contributor.author | Heylen, Rob | |
dc.contributor.author | Luso, Domenico | |
dc.contributor.author | Thanki, Aditi | |
dc.contributor.author | Philips, Wilfried | |
dc.contributor.author | Witvrouw, Ann | |
dc.contributor.author | Verhees, Dries | |
dc.contributor.author | Booth, Brian | |
dc.date.accessioned | 2023-08-01T15:32:59Z | |
dc.date.available | 2023-06-12T20:09:58Z | |
dc.date.available | 2023-08-01T15:32:59Z | |
dc.date.issued | 2023 | |
dc.identifier.issn | 0264-1275 | |
dc.identifier.other | WOS:000991403300001 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/41723.2 | |
dc.source | WOS | |
dc.title | Towards material and process agnostic features for the classification of pore types in metal additive manufacturing | |
dc.type | Journal article | |
dc.contributor.imecauthor | Vandecasteele, Mathieu | |
dc.contributor.imecauthor | Luso, Domenico | |
dc.contributor.imecauthor | Philips, Wilfried | |
dc.contributor.imecauthor | Booth, Brian | |
dc.contributor.orcidimec | Vandecasteele, Mathieu::0000-0001-8346-131X | |
dc.contributor.orcidimec | Philips, Wilfried::0000-0003-4456-4353 | |
dc.contributor.orcidimec | Luso, Domenico::0000-0001-7919-7878 | |
dc.contributor.orcidimec | Booth, Brian::0000-0001-9228-4810 | |
dc.date.embargo | 2023-03-31 | |
dc.identifier.doi | 10.1016/j.matdes.2023.111757 | |
dc.source.numberofpages | 20 | |
dc.source.peerreview | yes | |
dc.source.beginpage | Art. 111757 | |
dc.source.endpage | na | |
dc.source.journal | MATERIALS & DESIGN | |
dc.source.issue | March | |
dc.source.volume | 227 | |
imec.availability | Published - open access | |
dc.description.wosFundingText | This work was financially supported by the imec ICON VLAIO project Vision in the Loop' (HBC.2019.2808), a collaboration between TELIN-IPI-imec, Ghent University; Flanders MAKE@KU Leuven; Materialise; imec Vision Lab, University of Antwerp; Flanders MAKE; Dekimo; Manufacturing Processes and Systems (MaPS); ESMA; and AdditiveLab. We wish to thank all the partners for their assistance in technical discussions and data collection. | |