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BGA solder strain prediction using an Artificial Neural Network regressor
dc.contributor.author | Ferrando-Villalba, Pablo | |
dc.contributor.author | Vandevelde, Bart | |
dc.date.accessioned | 2023-06-20T10:33:55Z | |
dc.date.available | 2023-06-20T10:33:55Z | |
dc.date.issued | 2022 | |
dc.identifier.other | WOS:000812322900081 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/41829 | |
dc.source | WOS | |
dc.title | BGA solder strain prediction using an Artificial Neural Network regressor | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Ferrando-Villalba, Pablo | |
dc.contributor.imecauthor | Vandevelde, Bart | |
dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
dc.identifier.doi | 10.1109/EuroSimE54907.2022.9758918 | |
dc.identifier.eisbn | 978-1-6654-5836-8 | |
dc.source.numberofpages | 6 | |
dc.source.peerreview | yes | |
dc.source.conference | 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) | |
dc.source.conferencedate | APR 25-27, 2022 | |
dc.source.conferencelocation | St Julian | |
imec.availability | Under review |
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