Technological development for the reduction of out-of-plane deformation of metallic meander structures in thermoformed electronics

Abstract

This paper presents a novel approach for removing out-of-plane deformation in stretched metal interconnects by adding a fractal structure to the original meander shape and using an optimized fabrication stack. In thermoformed electronics, in cases where copper is used as conductor, the twisting of meander-shaped structures caused by excessive mechanical stress can cause a non-uniform surface, delamination of the metal interconnect from the substrate, and in some cases, a short circuit to the adjacent tracks. Typically, designers of stretchable electronics use various shapes and widths of the copper interconnect to tackle this issue. Using conventional meander shapes such as horseshoes and U-shapes is not universally practical, especially when stretching is higher than 30 percent leading to significant out-of-plane buckling. Limiting this out-of-plane buckling by reducing the track width is not always applicable, as a minimum width is needed from a technology and conductivity perspective. The presented approach is inspired by computational and experimental studies of multiple meander shapes and fabrication methods. A geometry- and fabrication-based approach is presented, reducing the mechanical stress of almost all possible meander shapes by increasing the meander's path length to accommodate the metal track's produced torque during stretching. An analytical approach is provided for calculating the optimal meander parameters and the optimal fabrication stack is achieved based on simulation results. Experiments and finite element modeling for a case study show the improvement in the stress distribution and reduction of out-of-plane buckling.