Publication:
Technological development for the reduction of out-of-plane deformation of metallic meander structures in thermoformed electronics
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Acq. date: 2026-10-12
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213 since deposited on 2023-06-20
13last month
11last week
Acq. date: 2026-10-12
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1177 since deposited on 2023-06-20
Acq. date: 2026-10-12
Citations