Publication:

Technological development for the reduction of out-of-plane deformation of metallic meander structures in thermoformed electronics

Date

2022
Journal article
https://doi.org/10.1007/s00170-022-08680-9
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dc.contributor.authorMadadnia, Behnam
dc.contributor.authorBossuyt, Frederick
dc.contributor.authorVanfleteren, Jan
dc.contributor.imecauthorMadadnia, Behnam
dc.contributor.imecauthorBossuyt, Frederick
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.contributor.orcidimecBossuyt, Frederick::0000-0003-3350-9295
dc.date.accessioned2023-07-03T09:56:36Z
dc.date.available2023-06-20T10:36:18Z
dc.date.available2023-07-03T09:56:36Z
dc.date.embargo2022-04-30
dc.date.issued2022
dc.identifier.doi10.1007/s00170-022-08680-9
dc.identifier.issn0268-3768
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/41940
dc.publisherSPRINGER LONDON LTD
dc.source.beginpage6649
dc.source.endpage6663
dc.source.issue9-10
dc.source.journalINTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
dc.source.numberofpages15
dc.source.volume119
dc.title

Technological development for the reduction of out-of-plane deformation of metallic meander structures in thermoformed electronics

dc.typeJournal article
dspace.entity.typePublication
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