Publication:
Technological development for the reduction of out-of-plane deformation of metallic meander structures in thermoformed electronics
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Acq. date: 2026-03-17
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146 since deposited on 2023-06-20
4last month
1last week
Acq. date: 2026-03-17
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1174 since deposited on 2023-06-20
Acq. date: 2026-03-17
Citations