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Challenges in introducing high-density interconnect technology in printed circuit boards for space applications
dc.contributor.author | Cauwe, Maarten | |
dc.contributor.author | Vandevelde, Bart | |
dc.contributor.author | Nawghane, Chinmay | |
dc.contributor.author | Van de Slyeke, Marnix | |
dc.contributor.author | Coulon, Alexia | |
dc.contributor.author | Heltzel, Stan | |
dc.date.accessioned | 2023-06-20T10:36:49Z | |
dc.date.available | 2023-06-20T10:36:49Z | |
dc.date.issued | 2023-JAN | |
dc.identifier.issn | 1868-2502 | |
dc.identifier.other | WOS:000722108500002 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/41960 | |
dc.source | WOS | |
dc.title | Challenges in introducing high-density interconnect technology in printed circuit boards for space applications | |
dc.type | Journal article | |
dc.contributor.imecauthor | Cauwe, Maarten | |
dc.contributor.imecauthor | Vandevelde, Bart | |
dc.contributor.imecauthor | Nawghane, Chinmay | |
dc.contributor.orcidimec | Cauwe, Maarten::0000-0002-6413-998X | |
dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
dc.contributor.orcidimec | Nawghane, Chinmay::0000-0002-1867-827X | |
dc.identifier.doi | 10.1007/s12567-021-00403-2 | |
dc.source.numberofpages | 12 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 101 | |
dc.source.endpage | 112 | |
dc.source.journal | CEAS SPACE JOURNAL | |
dc.source.issue | 1 | |
dc.source.volume | 15 | |
imec.availability | Under review |