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Demonstration of a collective hybrid die-to-wafer integration using glass carrier

dc.contributor.authorSuhard, Samuel
dc.contributor.authorKennes, Koen
dc.contributor.authorBex, Pieter
dc.contributor.authorJourdain, Anne
dc.contributor.authorTeugels, Lieve
dc.contributor.authorWalsby, Edward
dc.contributor.authorBolton, Chris
dc.contributor.authorPatel, Jash
dc.contributor.authorAshraf, Huma
dc.contributor.authorBarnett, Richard
dc.contributor.authorFodor, Ferenc
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorLa Tulipe, Douglas Charles
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2023-08-10T12:10:27Z
dc.date.available2023-06-20T10:37:03Z
dc.date.available2023-08-10T12:10:27Z
dc.date.issued2021
dc.identifier.issn0569-5503
dc.identifier.otherWOS:000702282700313
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/41967.2
dc.sourceWOS
dc.titleDemonstration of a collective hybrid die-to-wafer integration using glass carrier
dc.typeProceedings paper
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorKennes, Koen
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorTeugels, Lieve
dc.contributor.imecauthorFodor, Ferenc
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorLa Tulipe, Douglas Charles
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecJourdain, Anne::0000-0002-7610-0513
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.contributor.orcidimecPhommahaxay, Alain::0000-0001-8672-2386
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecKennes, Koen::0000-0002-5987-2167
dc.contributor.orcidimecFodor, Ferenc::0000-0001-9747-1981
dc.identifier.doi10.1109/ECTC32696.2021.00325
dc.identifier.eisbn978-0-7381-4523-5
dc.source.numberofpages7
dc.source.peerreviewyes
dc.source.beginpage2064
dc.source.endpage2070
dc.source.conferenceIEEE 71st Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateJUN 01-JUL 04, 2021
dc.source.conferencelocationSan Diego
dc.source.journalna
imec.availabilityPublished - imec


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220.500.12860/41967.2*2023-08-10T11:47:06Zvalidation by library/open access desk
120.500.12860/419672023-06-20T10:37:03Z

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