Demonstration of a collective hybrid die-to-wafer integration using glass carrier

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dc.contributor.author	Suhard, Samuel
dc.contributor.author	Kennes, Koen
dc.contributor.author	Bex, Pieter
dc.contributor.author	Jourdain, Anne
dc.contributor.author	Teugels, Lieve
dc.contributor.author	Walsby, Edward
dc.contributor.author	Bolton, Chris
dc.contributor.author	Patel, Jash
dc.contributor.author	Ashraf, Huma
dc.contributor.author	Barnett, Richard
dc.contributor.author	Fodor, Ferenc
dc.contributor.author	Phommahaxay, Alain
dc.contributor.author	La Tulipe, Douglas
dc.contributor.author	Beyer, Gerald
dc.contributor.author	Beyne, Eric
dc.date.accessioned	2023-06-20T10:37:03Z
dc.date.available	2023-06-20T10:37:03Z
dc.date.issued	2021
dc.identifier.issn	0569-5503
dc.identifier.other	WOS:000702282700313
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/41967
dc.source	WOS
dc.title	Demonstration of a collective hybrid die-to-wafer integration using glass carrier
dc.type	Proceedings paper
dc.contributor.imecauthor	Suhard, Samuel
dc.contributor.orcidext	Kennes, Koen::0000-0002-5987-2167
dc.contributor.orcidext	Fodor, Ferenc::0000-0001-9747-1981
dc.contributor.orcidext	Beyne, Eric::0000-0002-3096-050X
dc.identifier.doi	10.1109/ECTC32696.2021.00325
dc.identifier.eisbn	978-0-7381-4523-5
dc.source.numberofpages	7
dc.source.peerreview	yes
dc.source.beginpage	2064
dc.source.endpage	2070
dc.source.conference	IEEE 71st Electronic Components and Technology Conference (ECTC)
dc.source.conferencedate	JUN 01-JUL 04, 2021
imec.availability	Under review

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Version	Item	Date	Summary
2	20.500.12860/41967.2	2023-08-10T11:47:06Z	validation by library/open access desk
1	20.500.12860/41967*	2023-06-20T10:37:03Z