dc.contributor.author | Agnesina, Anthony | |
dc.contributor.author | Brunion, Moritz | |
dc.contributor.author | Kim, Jinwoo | |
dc.contributor.author | Garcia-Ortiz, Alberto | |
dc.contributor.author | Milojevic, Dragomir | |
dc.contributor.author | Catthoor, Francky | |
dc.contributor.author | Mirabelli, Gioele | |
dc.contributor.author | Komalan, Manu | |
dc.contributor.author | Lim, Sung Kyu | |
dc.date.accessioned | 2023-08-03T10:16:00Z | |
dc.date.available | 2023-06-24T19:58:57Z | |
dc.date.available | 2023-06-26T12:27:04Z | |
dc.date.available | 2023-08-03T10:16:00Z | |
dc.date.issued | 2023 | |
dc.identifier.issn | 2156-3950 | |
dc.identifier.other | WOS:000982913300002 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/42084.3 | |
dc.source | WOS | |
dc.title | Power, Performance, Area, and Cost Analysis of Face-to-Face-Bonded 3-D ICs | |
dc.type | Journal article | |
dc.contributor.imecauthor | Milojevic, Dragomir | |
dc.contributor.imecauthor | Catthoor, Francky | |
dc.contributor.imecauthor | Mirabelli, Gioele | |
dc.contributor.imecauthor | Komalan, Manu | |
dc.contributor.orcidimec | Catthoor, Francky::0000-0002-3599-8515 | |
dc.contributor.orcidimec | Mirabelli, Gioele::0000-0001-7060-4836 | |
dc.date.embargo | 2023-03-31 | |
dc.identifier.doi | 10.1109/TCPMT.2023.3264520 | |
dc.source.numberofpages | 15 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 300 | |
dc.source.endpage | 314 | |
dc.source.journal | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | |
dc.source.issue | 3 | |
dc.source.volume | 13 | |
imec.availability | Published - open access | |