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Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters

dc.contributor.authorDing, Youqi
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorLofrano, Melina
dc.contributor.authorZahedmanesh, Houman
dc.contributor.authorChavez, T.
dc.contributor.authorFarr, H.
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorCroes, Kristof
dc.date.accessioned2024-05-07T08:37:09Z
dc.date.available2023-07-15T17:05:47Z
dc.date.available2024-05-07T08:37:09Z
dc.date.issued2023
dc.identifier.issn1541-7026
dc.identifier.otherWOS:001007431500069
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42160.2
dc.sourceWOS
dc.titleThermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters
dc.typeProceedings paper
dc.contributor.imecauthorDing, Youqi
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecDing, Youqi::0000-0001-8873-572X
dc.contributor.orcidimecVarela Pedreira, Olalla::0000-0002-2987-1972
dc.contributor.orcidimecLofrano, Melina::0000-0002-3930-6459
dc.contributor.orcidimecZahedmanesh, Houman::0000-0002-0290-691X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.identifier.doi10.1109/IRPS48203.2023.10117870
dc.identifier.eisbn978-1-6654-5672-2
dc.source.numberofpages7
dc.source.peerreviewyes
dc.source.conference61st IEEE International Reliability Physics Symposium (IRPS)
dc.source.conferencedateMAR 26-30, 2023
dc.source.conferencelocationMonterey
dc.source.journalN/A
imec.availabilityPublished - imec
dc.description.wosFundingTextThe authors would like to thank the participants of reliability and thermal meetings as well as the members of the Nano-interconnect program for the fruitful discussions. Also, imec's industrial affiliation R&D program on Optical I/O is acknowledged for support on the thermal gradient test structure. Special thanks go to Emmanuel Chery for his assistance with measurement preparation and valuable insight on visualization. Myriam Van de Peer and Veerle Simons are acknowledged for their help with operational work and Chris Drijbooms, Manasi Gade and Filip Beirnaert for the FIB and SEM inspections.


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220.500.12860/42160.2*2024-05-07T08:33:04Zvalidation by library/open access desk
120.500.12860/421602023-07-15T17:05:47Z

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